SMT surface mount refers to a series of process flows that are processed on the basis of PCB. PCB (Printed Circuit Board) means printed circuit board. SMT (Printed Circuit Board) refers to a series of process flows that are processed on the basis of PCB (Printed Circuit Board). SMT, short for Surface Mounted Technology, is currently the most popular technology and process in the electronic assembly industry. Surface Mount Technology (SMT) for electronic circuits, also known as surface mount or surface mount technology. It is a circuit assembly technology that installs surface mount components (SMC/SMD) without pins or short leads on the surface of a printed circuit board (PCB) or other substrate, and assembles them by soldering or immersion soldering.

In general, the electronic products we use are designed from PCBs with various capacitors, resistors, and other electronic components according to the designed circuit diagram. Therefore, various electrical appliances require different SMT surface mount processing techniques for processing.

Basic process components of SMT: solder paste printing -->part mounting -->reflow soldering -->AOI optical inspection -->maintenance -->board splitting.

Some people may ask why it is so complicated to connect electronic components? This is actually closely related to the development of our electronics industry. Nowadays, electronic products pursue miniaturization, and the perforated plug-in components used in the past cannot be reduced in size. Electronic products have more complete functions, and the integrated circuits (ICs) used no longer have perforated components, especially large-scale and highly integrated ICs, which have to use surface mount components. Mass production and automation of products require manufacturers to produce high-quality products at low cost and high output to meet customer needs and enhance market competitiveness. The development of electronic components, integrated circuits (ICs), and the diverse applications of semiconductor materials are also important. The electronic technology revolution is imperative, chasing the international trend. It can be imagined that with the production processes of international CPU and image processing device manufacturers such as Intel and AMD advancing to just over 20 nanometers, the development of surface mount technology and processes like SMT cannot be achieved.

The advantages of SMT surface mount processing are high assembly density, small size and light weight of electronic products. The volume and weight of SMT components are only about 1/10 of traditional plug-in components. Generally, after using SMT, the volume of electronic products is reduced by 40% to 60%, and the weight is reduced by 60% to 80%. High reliability and strong anti vibration ability. The defect rate of solder joints is low. Good high-frequency characteristics. Reduced electromagnetic and radio frequency interference. Easy to implement automation and improve production efficiency. Reduce costs by 30% to 50%. Save materials, energy, equipment, manpower, time, etc.

It is precisely because of the complex process flow of SMT surface mount processing that many SMT surface mount processing factories have emerged, specializing in SMT surface mount processing. In Shenzhen, thanks to the booming development of the electronics industry, SMT surface mount processing has achieved the prosperity of an industry.