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Operation process of SMT full solder paste printing machine
Release time:2025-12-19 Click count: 983

Operation process of SMT full solder paste printing machine:

① Check the steel mesh before printing PCB、 Can solder paste and other fixtures be matched;

② Check if there are any residual foreign objects such as tin slag on the steel mesh, and if the surface of the plate is clean;

③ Confirm whether the brand and model of solder paste used are correct;

④ Confirm the reheating and stirring time (reheating for 4 hours, stirring for 5 minutes);

⑤ The engineer places the steel mesh and fixture on the printing machine, adjusts the parameters, and then starts running;

⑥ Check the PCB for deformation, damage, foreign objects, and oxidation before printing, and wipe the surface with a dust-free cloth;


⑦ After printing the sample, use a manual magnifying glass and SPI to check the printing quality; ⑧ If the printing quality is poor, first use a soft scraper to scrape off the solder paste on the board surface, then clean the remaining solder paste in the board surface and holes with board washing water, and then use a blow drying tool; Precautions for SMT fully automatic solder paste printing machine: ① Do not operate the machine when the printing machine door is opened or has problems. ② Steel mesh cannot block holes. ③ Solder paste adheres to the principle of small amounts and repeated increases. ④ If there is no printing for more than an hour, the solder paste needs to be recycled. ⑤ During the printing process, if there are printing abnormalities, the staff should immediately handle them.